600mW 520nm Single Emitter Laser Chip

600mW output power, 520nm central wavelength

Available with TO 9mm package

Heat dissipation design: the laser chip will generate a lot of heat when working, so the package structure needs to design a heat dissipation channel to effectively reduce the temperature of the laser chip. Common heat dissipation designs include the use of heat sinks, heat dissipation plates and other heat dissipation devices to improve heat dissipation efficiency.